{"id":429,"date":"2022-05-16T10:04:03","date_gmt":"2022-05-16T10:04:03","guid":{"rendered":"https:\/\/transcend.tempelgroup.com\/blog\/?p=429"},"modified":"2022-05-20T07:47:12","modified_gmt":"2022-05-20T07:47:12","slug":"underfill","status":"publish","type":"post","link":"https:\/\/transcend.tempelgroup.com\/blog\/underfill\/","title":{"rendered":"Underfill"},"content":{"rendered":"

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Embedded systems are marked by a need for small components, unmatched reliability, and the ability to withstand harsh conditions. Transcend Information offers underfill as a customization option for its embedded products to increase reliability under high thermal or vibratory stress, high gravitational acceleration, and high fatigue cycle applications.<\/span><\/p>\n

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How underfill works<\/h2>\n

Underfill is typically a polymer or liquid epoxy that is applied just underneath the perimeter of the silicon chip on a PCB after it has passed through a reflow oven. The PCB is then heated so that the underfill is absorbed underneath the chip via capillary action.<\/p>\n

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Main functions<\/h2>\n

Underfill is commonly used for ball grid array (BGA) based storage for applications such as handheld devices, which must pass drop or tumble tests.<\/p>\n

When a BGA device is exposed to repeated heating and cooling cycles, a BGA chip will expand or contract at a different rate than that of the underlying substrate, due to the difference in each material’s coefficient of thermal expansion. This differential creates mechanical stress on the device\u2019s solder joints.<\/p>\n

Underfill is used as a stress relieving agent, evenly distributing the expansion and contraction effects. By spreading stresses throughout the chip and PCB interface with a mechanical bond, less stress is concentrated on the solder joints, increasing device reliability.<\/p>\n

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Transcend quality<\/h2>\n

Transcend strives to ensure that our underfill process is stringent and standardized for the best quality and longevity of our products. We also implement another technology – corner bond – to enhance reliability. Click\u00a0<\/span>here\u00a0<\/span><\/a>to know more.<\/p>\n<\/div>\n<\/div>\n

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